The linear distance across the surface of a circular slice which contains the slice center and excludes any flats or other peripheral fiduciary areas. Standard silicon wafer diameters are: 25.4mm (1"), 50.4mm (2"), 76.2mm (3"), 100mm (4"), 125mm(5"), 150mm (6"), 200mm (8"), and 300mm (12"). The linear dimension across the surface of a wafer. Measurement is performed manually with ANSI certied digital calipers on each individual wafer.
Thin (thickness depends on wafer diameter, but is typically less than 1mm),circular slice of single-crystal semiconductor material cut from the ingot of single crystal semiconductor; used in manufacturing of semiconductor devices and integrated circuits; wafer diameters may range from 5mm to 300mm. Measured with ANSI certied non-contact tools at the center of each individual wafer.
Linear dimension of the at measured with ANSI certied digital calipers on a sample of one wafer per ingot.
Denotes the orientation of the surface of a wafer with respect to a crystallographic plane within the lattice structure. In wafers cut intentionally “off orientation”, the direction of cut is parallel to the primary at, away from the secondary at. Measured with x-ray goniometer on a sample of one wafer per ingot in the center of the wafer.
In wafers cut intentionally “off orientation”, the angle between the projection of the normal vector to the wafers surface onto a {0001} plane and the projection on that plane of the nearest <11-20> direction.
The flat of longest length on the wafer, oriented such that the chord is parallel with a specified low index crystal plane; major flat. The primary at is the {10-10} plane with the at face parallel to the <11-20> direction.
The at of the longest length on the wafer, oriented such that the chord is parallel with a specied low index crystal plane. Measured on one wafer per ingot using Laue back-reection technique with manual angle measurement.
A at of shorter length than the primary orientation at,whose position with respect to the primary orientation at identies the face of the wafer.
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