Xiamen Powerway offers InP wafer - Indium Phosphide which are grown by LEC(Liquid Encapsulated Czochralski) or VGF(Vertical Gradient Freeze) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).
Xiamen Powerway offers InP wafer - Indium Phosphide which are grown by LEC(Liquid Encapsulated Czochralski) or VGF(Vertical Gradient Freeze) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).
Indium phosphide (InP) is a binary semiconductor composed of indium and phosphorus. It has a face-centered cubic ("zinc blende") crystal structure, identical to that of GaAs and most of the III-V semiconductors.Indium phosphide can be prepared from the reaction of white phosphorus and indium iodide[clarification needed] at 400 °C.,[5] also by direct combination of the purified elements at high temperature and pressure, or by thermal decomposition of a mixture of a trialkyl indium compound and phosphide. InP is used in high-power and high-frequency electronics[citation needed] because of its superior electron velocity with respect to the more common semiconductors silicon and gallium arsenide.
Wafer Specification | |
Item | Specifications |
Wafer Diameter | 50.5±0.4mm |
Crystal Orientation | (100)±0.1° |
Thickness | 350±25um / 500±25um |
Primary flat length | 16±2mm |
Secondary flat length | 8±1mm |
Surface Finish | P/E, P/P |
Package | Epi-Ready,Single wafer container or CF cassette |
Electrical and Doping Specification | ||||||
Conduction Type | n-type | n-type | n-type | n-type | p-type | p-type |
Dopant | Undoped | Iron | Tin | Sulphur | Zinc | Low Zinc |
E.D.P cm-2 | ≤5000 | ≤5000 | ≤50000 | ≤1000 | ≤1000 | ≤5000 |
Mobility cm² V-1s-1 | ≥4200 | ≥1000 | 2500-750 | 2000-1000 | Not Specified | Not Specified |
Carrier Concentration cm-3 | ≤1016 | Semi-Insulating | (7-40)*1017 | (1-10)*1018 | (1-6)*1018 | (1-6)*101 |