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2-4.Wafer Surface Orientation

2.Definition of Dimensional Properties,Terminology and Methods of Silicon Carbide Wafer

2-4.Wafer Surface Orientation

2018-01-08

Denotes the orientation of the surface of a wafer with respect to a crystallographic plane within the lattice structure.

In wafers cut intentionally “off orientation”, the direction of cut is parallel to the primary  at, away from the secondary  at.


Measured with x-ray goniometer on a sample of one wafer per ingot in the center of the wafer.

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