Q:Our application will be making micro-pillar arrays based on the MQWs for high brightness LEDs and its wavelength tuning. So we do not really care the emission wavelength you provide but we will mind whether the process and emission wavelength would be consist between wafers in one pack as well as the uniformity in one wafer. No metal contact would be perfect as we will employ high temperature process in our application. Do you offer the wafer dicing service as well?
A:You require good uniformity between wafer and wafer, also you require good uniformity in one wafer.From you application, you need patterned sapphire substrate with epi layers, (flat sapphire with epi layers is not available).You said you cut chip size 1cm*1cm, I guess you mean: you want 45mil chip size, and then list an array, such as: 10pcs*10pcs of 45mil chip size.Because if for single chip size>=1cm, the brightness is not as good.Because LED have droop effect.
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